Distinguished Architect, Advanced Packaging
Job Summary
To shape the future of semiconductor design, the full-time Distinguished Architect, Advanced Packaging will architect and drive package substrate design automation within the 3DIC Compiler platform, focusing on advanced multi-die systems while working remotely.
Key responsibilities
- Architect and implement design automation capabilities for package substrates within the 3DIC Compiler
- Develop production-grade algorithms for HDI substrate auto-routing and design rule checking
- Collaborate with customers and product teams to translate design challenges into effective technical solutions
Required qualifications
- Deep expertise in advanced packaging or package substrate design, routing, and manufacturability
- Proven experience in building scalable production software products
- Strong algorithmic foundation for physical design automation challenges
- Expert-level C/C++ skills for large-scale systems
- Advanced degree in Computer Science, Electrical Engineering, or equivalent hands-on R&D experience
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