Senior Hardware IC Packaging Engineer

Job Summary

A company is looking for a Senior Hardware IC Packaging Design Engineer.

Key Responsibilities

• Drive early chip-package co-design and development of bump and ball maps
• Own layout of package types such as FCCSP, FCBGA, FCQFN, WLCSP, QFN
• Collaborate with multiple cross-functional teams including Chip Design and SI/PI

Required Qualifications

• Proficiency with Cadence Allegro Package Designer (APD) and AutoCAD
• Minimum 4+ years of experience in packaging design and layout
• Proven track record with multiple packaging types in volume production
• Experience routing high-speed, high pin count devices
• Knowledge of organic laminate substrate technologies and manufacturing capabilities