Senior Package Layout Engineer
Location: Remote
Compensation: Salary
Reviewed: Wed, Apr 29, 2026
This job expires in: 30 days
Job Summary
A company is looking for a Senior Package Layout Engineer - Hardware.
Key Responsibilities
- Collaborate with design teams to implement high-speed/density ASIC packages
- Optimize package pinout and perform substrate breakout patterns for ASIC packages
- Conduct design feasibility studies and develop methodologies to improve layout productivity
Required Qualifications
- B.S. in Electrical Engineering or equivalent experience
- 5+ years of experience in PCB Layout of related technologies
- Proven experience in substrate layout of wire bond and flip chip packages
- Significant background with Cadence APD or SiP and/or PCB layout tools
- Solid understanding of high-speed design signal integrity practices
COMPLETE JOB DESCRIPTION
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