Senior Package Layout Engineer
Job Summary
Collaborating with design teams, the full-time Senior Package Layout Engineer will focus on the design and development of intricate IC substrate layouts for NVIDIA products, working in a hybrid environment to address manufacturing and electrical design challenges.
Key responsibilities
- Implement high-speed/density ASIC package layouts as part of a collaborative Layout team
- Optimize package pinout and perform substrate breakout patterns for ASIC packages
- Conduct design feasibility studies to evaluate package design goals regarding size, cost, and system performance
Required qualifications
- B.S. in Electrical Engineering or equivalent experience
- 5+ years of experience in PCB layout for graphics cards, motherboards, or related technology
- Proven experience in substrate layout of wire bond and flip chip packages
- Significant background with Cadence APD or SiP and/or PCB layout tools
- Solid understanding of high-speed design signal integrity practices
Complete Job Description
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