Senior Packaging Engineer

Job Summary

Driving technology across multiple functions, the full-time Senior Packaging Technical Engineer will craft and implement silicon pad rings and lead the package layout design process while collaborating with cross-functional teams in a remote environment.

Key responsibilities

• Define and implement chip pad rings, substrate interconnect schemes, and lead package layout design
• Collaborate with engineers and managers from various disciplines, including Circuit, Signal Integrity, and system design
• Develop chip floor plans, pad rings, and robust electrical packages

Required qualifications

• BSEE or equivalent experience
• Minimum of 8+ years in board/system design, with package design experience preferred
• Strong understanding of transmission line theory, power delivery, and signal integrity
• Programming and scripting skills in Perl, Python, Tcl, and familiarity with Cadence Skill and Excel are advantageous
• Ability to work independently and tackle complex technical problems