Senior Packaging Engineer

Job Summary

Driving technology across multiple functions, the full-time Senior Packaging Technical Engineer will define and implement chip pad rings, collaborate with cross-functional teams, and design robust electrical packages, with opportunities for remote work.

Key responsibilities

• Define and implement chip pad rings and substrate interconnect schemes while leading the package layout design process
• Collaborate with large teams of engineers and managers across various disciplines including Circuit, Signal Integrity, and system design
• Develop chip floor plans, pad rings, substrates, and ball outs to create a world-class electrical package

Required qualifications

• BSEE or equivalent experience
• Minimum of 8+ years in board/system design, with package design experience preferred
• Strong understanding of transmission line theory, power delivery, and signal integrity
• Programming and scripting skills in Perl, Python, Tcl, and familiarity with Cadence Skill and Excel are preferred
• Ability to work independently while solving complex technical problems