Package Layout Engineer
Job Summary
Collaborating with design teams, the full-time Package Layout Engineer will focus on the design and development of intricate IC substrate layouts for NVIDIA products while working remotely or from various locations.
Key responsibilities
- Implement high speed/density ASIC packages and perform substrate breakout patterns
- Optimize package pinout and conduct design feasibility studies to meet package design goals
- Develop symbols and CAD library databases using Cadence APD design tools and improve layout productivity methodologies
Required qualifications
- B.S. in Electrical Engineering or equivalent experience
- 2+ years of experience in PCB Layout for graphics cards, motherboards, or related technology
- Proven experience in substrate layout of wire bond and flip chip packages
- Significant background with Cadence APD or SiP and/or PCB layout tools
- Solid understanding of high-speed design signal integrity practices
Complete Job Description
The complete job description is available to members. Premium membership includes:
Full access to 40,121 remote jobs from human-vetted companies, updated daily
Resume Builder - AI-powered tool to craft, enhance, and tailor your resume to a specific job
Twice-monthly live group coaching and the full Remote Career Center
20% member discount on Career Services
Backed by a 30-day money-back guarantee
Company Company Name
Headquarters Headquarters
Founded Founded
Website
Wikipedia Wikipedia URL
BBB URL BBB URL
The company description is available to members. Go Premium for full access to every job and company profile in our remote jobs database, backed by a 30-day money-back guarantee.
