Principal ASIC Package Design Engineer

Job Summary

Leading advanced ASIC package architecture and execution, the remote Principal ASIC Package Design Engineer will focus on flip-chip BGA and multi-chip module solutions, managing the end-to-end package strategy for high-performance mixed-signal and digital SoCs.

Key responsibilities

• Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up and power delivery
• Lead package-level trade studies across cost, performance, and reliability while establishing design standards and methodologies
• Manage relationships with external packaging vendors and drive material selection and assembly process optimization

Required qualifications

• Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field
• 10+ years of experience in ASIC package design, specifically with FC-BGA expertise
• Proven track record of delivering high-pin-count, high-performance ASIC packages into production
• Strong understanding of substrate technologies, SI/PI fundamentals, and thermal management for power-dense ASICs
• Fluency in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS