Principal ASIC Package Design Engineer

Job Summary

Leading advanced ASIC package architecture and execution, the remote Principal ASIC Package Design Engineer will manage the end-to-end package strategy for high-performance mixed-signal and digital SoCs, focusing on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

Key Responsibilities

• Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up and power delivery
• Lead package-level trade studies across cost, performance, and reliability while defining long-term packaging roadmaps
• Manage relationships with external packaging vendors and drive material selection and assembly process optimization

Required Qualifications

• Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field
• 10+ years of experience in ASIC package design, particularly with FC-BGA
• Proven experience delivering high-pin-count, high-performance ASIC packages into production
• Strong understanding of substrate technologies, SI/PI fundamentals, and thermal management for power-dense ASICs
• Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS