Senior ASIC Package Design Engineer

Job Summary

To support the development of high-performance satellite technology, the remote Senior ASIC Package Design Engineer will implement advanced ASIC package architecture, focusing on flip-chip BGA and multi-chip module solutions while collaborating with internal teams and managing vendor relationships.

Key responsibilities

• Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up and power delivery
• Lead package-level trade studies across cost, performance, and reliability while establishing design standards and methodologies
• Drive detailed design of high-pin-count ASIC packages and support package-level signal and power integrity strategies

Required qualifications

• Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field
• 5+ years of experience in ASIC package design with expertise in flip-chip BGA
• Proven experience delivering high-performance ASIC packages into production
• Strong understanding of substrate technologies, SI/PI fundamentals, and thermal management for ASICs
• Fluency in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS