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Senior Hardware IC Packaging Engineer
Job Summary
A company is looking for a Senior Hardware IC Packaging Design Engineer.
Key Responsibilities
- Drive early chip-package co-design and development of bump and ball map
- Own layout of package types such as FCCSP, FCBGA, FCQFN, WLCSP, QFN
- Collaborate with multiple cross-functional teams (Chip Design, SI/PI, Packaging)
Required Qualifications
- Proficiency with Cadence Allegro Package Designer (APD) and AutoCAD
- Minimum 4+ years of experience in packaging design and layout, preferably in an advanced silicon node
- Proven track record with multiple packaging types where products have gone to volume production
- Experience routing high-speed, high pin count devices and understanding of signal and power integrity fundamentals
- Knowledge of organic laminate substrate technologies and manufacturing capabilities
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