Senior Package Layout Engineer
Location: Remote
Compensation: Salary
Reviewed: Mon, May 12, 2025
This job expires in: 19 days
Job Summary
A company is looking for a Senior Package Layout Engineer - Hardware.
Key Responsibilities
- Collaborate with design teams to implement high speed/density ASIC packages and perform substrate breakout patterns
- Optimize package pinout and conduct design feasibility studies to evaluate package design goals
- Develop CAD library databases and methodologies to improve layout productivity using Cadence APD or SiP tools
Required Qualifications
- B.S. in Electrical Engineering or equivalent experience
- 5+ years of experience in PCB Layout of related technologies, with HDI design experience being a plus
- Proven experience in substrate layout of wire bond and flip chip packages
- Significant background with Cadence APD or SiP and PCB layout tools
- Solid understanding of high-speed design signal integrity practices
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